Technology and R&D
We are committed to exploring unknown materials
and carrying out R&D on cutting-edge technologies
in the pursuit of new value.
We are committed to exploring unknown materials
and carrying out R&D on cutting-edge technologies
in the pursuit of new value.
Since our founding in 1924, we have been providing original and high-quality products to a wide range of fields, including semiconductors, energy, chemicals, automobiles, sea vessels, and medical treatment and pharmaceuticals, by leveraging our fluid control and materials technologies, based on our core principles: the environment (CLEAN), safety (SAFETY), and contribution to cutting-edge technologies (FRONTIER). Building upon these technological capabilities, we continue to take on new challenges to help solve social issues and realize a sustainable future.
It is necessary to accommodate an extremely wide range of operating conditions for fluid control of liquid hydrogen and hydrogen gas: from cryogenic temperatures of -253°C to high temperatures of 600°C and from low pressures of several kPaG to high pressures of 100 MPaG. Furthermore, it is essential to take measures to address physical properties unique to hydrogen, such as hydrogen embrittlement.
To tackle these challenges, we are focusing on improving sealing performance and advancing the development of products that support the businesses of our customers as they aim to help realize a carbon-neutral society. We pursue various approaches in our R&D efforts. As one example of this, we are aiming to elucidate the unique wear phenomena (tribology) that occur in hydrogen atmospheres through industry-academia collaboration.
By leveraging our know-how and integrating these initiatives, we are successfully developing higher performance and more reliable products.
PILAFLON™ V-rings, PILAFLON™ HiP seals, spiral wound gaskets,
EDP packings, and PPG dry gas seals
Product Features
| Item | Previous Material (F Series) |
New Material: F919 | |
|---|---|---|---|
| Base material | PTFE | Special PTFE | |
| Filler | Special carbon | Heat-resistant resin / graphite powder / carbon fiber |
|
| Specific gravity | 1.85 | 1.94 | |
| Hardness | Durometer D 69 | Durometer D 68 | |
| Coefficient of thermal expansion |
Machine direction (MD) | 9.4 ×10-5/°C | 15.8 ×10-5/°C |
| Cross direction (CD) | 8.0 ×10-5/°C | 4.3 ×10-5/°C | |
| Sulfur content | Trace amount present | None | |
| Specific wear rate | 3.9 ×10-6 mm3N·m | 2.4 ×10-7 mm3N·m | |
Product Features
| Item | #4950 |
|---|---|
| Size range | Nominal inside diameter ≤100 |
| Normal maximum operating pressure | 5.2 MPa (equivalent to Class 300) |
| Fluid temperature | -253 to 100°C*1 |
| Sliding speed | Up to 1.0 m/s |
| PV value | Up to 1.0 MPaG·m/s*1 |
| Minimum clamping pressure | 25 N/mm2 |
| Item | Gland Packing | #4950 Cryogenic Seal Set |
|---|---|---|
| Leakage (-253°C) |
Leakage of 1 mL/min at cryogenic temperatures (-253°C) (Fluid: Helium gas at 12.9 MPa) |
No leakage detected (Fluid: Helium gas at 12.9 MPa) |
| Appearance |
Wear debris present
Major sliding marks |
No visible wear debris
Minor sliding marks |
In 2022, we established a new organization to develop carbon neutrality into a core pillar of our business and began the full-scale development of new products. We have introduced our proprietary state-of-the-art hydrogen atmosphere friction and wear testing machine. Using this machine, we are striving to improve performance in product (materials) development to elucidate unique wear phenomena (tribology).

In order to meet the ever more stringent cleanliness requirements associated with the increasing miniaturization of semiconductors, we are building a system capable of performing multifaceted analysis (on both organic and inorganic substances).

We seamlessly perform basic structural analysis and design. This leads to faster product design and proposals.

To evaluate performance under the harsh operating conditions in the semiconductor fabrication industry, we utilize thermal cycle test equipment capable of cycling between high and low temperatures.

This test equipment is used to collect and analyze data on pressure, temperature, torque, vibration, etc. under operating conditions, including failure modes, in order to establish technology for predicting mechanical seal failures.

This test equipment is used to collect data on sealing, sliding, stress relaxation, and other characteristics for valve gland packings under low temperature environments (-150 to 0°C). We use this data in the development of gland packings suitable for low temperature environments.

The device is capable of performing sealing, compression, and tensile tests while precisely controlling the load on products and materials. With 24-hour continuous operation possible, continuous data can be obtained on changes that occur over time.
The PILLAR Group places a strong emphasis on creating value through technological innovation and is committed to protecting and using intellectual properties. With the Innovation Center at Sanda Factory serving as our hub, we are driving technological development and appropriately protecting the intellectual properties arising from the creation of new technologies and products in the electronic equipment-related and industrial equipment-related business fields, while striving to provide added value to our customers.
In addition, we view intellectual property activities as the foundation for sound business operations. Accordingly, we clearly state in our Group Code of Conduct our commitment to acquiring our own intellectual properties while respecting those of other companies and refraining from unauthorized infringement or imitation, thereby raising awareness among our employees.

Measurement results are shared with each production site via our internal network and the results are then analyzed.
Going forward, we will also promote the use of real-time molding conditions to further improve productivity.

We use a coordinate measuring machine to assess the characteristics of major areas that affect the sealing performance of molded parts, provide feedback, and then reflect the results into product quality, including process capacity.