Technology and R&D
In the pursuit of new value,
we are exploring novel materials and
emphasizing R&D of next-generation technology.
- Company Profile
Company Profile
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Message
Read a message from President Yoshinobu Iwanami.
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Our Philosophy
Read the Corporate Principles and Management Philosophy of Nippon Pillar Group and the Group Code of Conduct.
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Company Data
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Directors and Executive Officers
Meet our Directors and Executive Officers.
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History
Find out about Nippon Pillar Packing’s history as a developer of products delivering new value.
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Group Network
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Mother Factories that Underpin Our Business
Read about our mother factories with an integrated system from development to production.
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Procurement
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Quality
Find out about Nippon Pillar Packing’s approach to quality and read the Quality Policy.
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Message
- Business Overview
Business Overview
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Our Business
Our cutting-edge technologies are contributing to diverse fields, everything from semiconductor production and seismic isolation to IT.
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Technology and R&D
In pursuit of new value, we are exploring novel materials and emphasizing R&D of next-generation technology.
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Our Business
- Product Information
- Investor Relations
Investor Relations
- Management Policies To Individual Investors
- IR library Shareholder Information
- Financial Highlights Stock Quotes IR FAQ Agreement
- Sustainability
Sustainability
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The Value Creation Process
Read about Value Creation Process at Nippon Pillar Packing.
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Materiality
Read about Materiality at Nippon Pillar Packing.
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Nippon Pillar Packing by the Numbers
A snapshot of Nippon Pillar Packing in numbers.
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Information Disclosure based on the TCFD recommendations
Read about information disclosure based on the TCFD recommendations.
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Environment
Read about environmental initiatives at Nippon Pillar Packing.
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Social
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Governance
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External Evaluations and Activities
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Integrated Report
Read our integrated report.
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The Value Creation Process
- Inquiries
Inquiries
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Inquiries about Our Products
Inquiries about Our Products
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Inquiries about Investor Relations
Inquiries about Investor Relations
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Inquiries about Our Products
Seeking New Values and Striving to Research
and Develop Unknown Materials
Microscopic analysis technology
In order to meet the increasingly stringent cleanliness requirements associated with the miniaturization of semiconductors, we are building a system capable of multifaceted analysis (both inorganic and organic).
Design with 3D CAD
We perform basic structural analysis and design seamlessly, leading to faster product design and proposals.
Test equipment for semiconductor and liquid crystal manufacturing devices
To evaluate performance under severe operating conditions in the semiconductor market, we have thermal cycle test equipment capable of cycling through high and low temperatures.
Data collection and analysis test equipment for failure prediction
This test equipment is used to collect and analyze data on pressure, temperature, torque, vibration, etc. under operating conditions, including failure modes, in order to establish technology for predicting mechanical seal failures.
Low temperature test equipment for valves
This test equipment is used to collect data on sealing characteristics, sliding characteristics, and stress relaxation characteristics of gland packing for valves in low temperature environments (-150 to 0°C). It is utilized for the development of gland packing suitable for lowtemperature environments.
Friction and abrasion tester
This tester is used for technical evaluation of sliding friction and abrasion characteristics between the material to be evaluated and the mating material to be used for sealing materials. Both ring-on-ring and pin-on-disk testing are possible.
Statistical Quality
Control Measures
Analysis by data analysis software
Measurement results are shared with each production site via the in-house network, and the results are analyzed. In the future, we plan to further improve productivity by utilizing real-time molding conditions.
High-precision measurement and
data utilization with 3D measuring instruments
Three-dimensional measuring instruments assess the characteristics of critical parts that affect the sealing function of molded parts and provide feedback, which is reflected in product quality, including process capability.