Microwave PC Board Material "PILAR PC-CLAD" is the ideal copper-clad laminates for micro to millimeter wave circuits.
"PILLAR PC-CLAD" which minimizes. Variety in thickness and dielectric properties through our own unique forming technology is a fluorocarbon resin board for high-frequency circuits. It is made with high quality prepreg that utilizes superior coating technology. "PILLAR PC-CLAD" is ideal for multi-layer printed circuit boards, as well as a double-sided printed circuit boards for micro to millimeter wave equipment. We have also obtained many patents for related technologies. |
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Low-loss board for micro to millimeter wave bands
PILLAR PC-CLAD has tanσ= 0.0006 (12GHz), and affords superior antenna and circuit characteristics. |
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Low coefficient of water absorption, and allows very little permeation by chemicals
Properties of PILLAR PC-CLAD are not affected by moisture, so it can be widely utilized regardless of conditions. |
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Superior copper foil adhesion
Maintains adhesion strength at high temperatures to enhance reliability of fine patterns. |
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Ideal for multi-layer boards
Original perperg multi-layering technology enables PILLAR PC-CLAD to withstand hot solder and obtain the same dielectric properties for all insulation layers, making PILLAR PC-CLAD ideal for multi-layering of high-frequency circuits. Low temperature molding products are also available. |
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Converter boards for BS/CS antennas, radar for small boats |
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Wireless LAN, FWA |
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ITS, ETC antennas, and millimeter wave for ASV |
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R.F. components (filters, power dividers, mixers, couplers, E/O, O/E, converters etc.), cellular telephone base stations, antenna modules, satellite cellular telephone terminals |
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High-frequency semiconductors |
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