Mechanical seals, NIPPON PILLAR PACKING Co.,Ltd.

The fluorocarbon resin film substrate is an ultra-thin copper-clad laminates which uses the glass cloth and fluorocarbon resin for its dielectric to realize thinning, lightweight and reduced loss for substrate.
Using the thin copper foil has made it possible to realize "Fine pattern".

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■Features

◆The thickness of dielectric was reduced to 40μ and 50μ.

◆The substrate has realized the dielectric constant of 2.6 and dissipation factor of 0.003 at 10GHz.

◆The substrate contains glass cloth, however, it has flexibility.